SAMSUNG Internal M.2 NVMe PCIe 5.0 SSD with heatsink 9100-PRO-HEATSINK 2TB 14700MB/S DSP0000033302

Samsung features 9100 PRO MZ-VAP2T0 2TB
The **Samsung 9100 PRO MZ-VAP2T0** is a high-performance internal SSD designed for users who demand maximum speed, thermal efficiency and reliability. Thanks to its **PCIe 5.0 x4** interface and **Samsung V-NAND TLC** technology, it is ideal for professional environments, demanding gaming, workstations and content creators who require ultra-fast load times and intensive data transfers.
Extreme speed with PCIe 5.0 and NVMe 2.0
This model offers one of the highest transfer rates on the market, thanks to its **PCIe 5.0** interface, which is compatible with **NVMe 2.0**, enabling faster and more efficient workflows. Whether running demanding software or transferring large volumes of files, performance is guaranteed.

Sequential read: up to 14.700 MB/s
Sequential write: up to 13,400 MB/s
Random 4K read/write IOPS: up to 1.850.000 / 2.600.000

Efficient thermal design and advanced durability
It includes an **integrated heatsink** that maintains optimal temperatures even under heavy loads, extending the device's lifespan and preventing performance drops. In addition, its write endurance is **up to 1200 TBW**, making it ideal for prolonged intensive use.

Built-in metal heat sink
Write endurance : 1200 TBW
MTBF: 1,500,000 hours

Advanced security and management software
The Samsung 9100 PRO includes **256-bit AES encryption** and complies with the **IEEE 1667** standard, ensuring your data is always protected. In addition, with **Samsung Magician** software, you can monitor the SSD's status, update firmware and optimise performance in real time.

Hardware encryption: 256-bit AES
Compatible with TRIM, S.M.A.R.T. and Device Sleep
Included software: Samsung Magician

Compact form factor and energy efficiency
With an **M.2 2280** form factor, it is compatible with a wide range of modern motherboards. Its power consumption is notably efficient for its performance level, including a low-power mode for idle and sleep states.

Form factor : M.2 2280
Power consumption: 8.1 W (read), 7.9 W (write), 4.8 W (idle), 4 mW (sleep mode)
Dimensions: 81.3 x 22.9 x 8.89 mm | Weight: 31.8 g

Other specifications

Memory type: NAND TLC (Triple-Level Cell)
Operating temperature: from 0 °C to 70 °C
Shock resistance (non-operating): up to 1500 g
Regulatory compliance : IEEE 1667
Includes retail hanging box
Volume (m ³): 0.0003